Sn-4Ag계 Pb-free 솔더 접합부의 Cu 함량에 따른 접합강도 특성평가

The evaluation on reliability of environment-friendly Pb-free solder and solder joints is very important. This study compared the shear strength of two different plates(Cu and Ni plate). Also, shear strength of joints of Sn-37Pb solder and Sn-Ag solder alloy with different Cu contents(0, 0.5, 1 wt.%) have been studied. The shear strength tests on various reflow time are performed at 30 and 50℃. The shear strength of Pb-free solder joints are higher than Sn-37 Pb solder joints, generally. In the case of Cu plate, shear strength of Sn-4Ag solder joints increased with reflow time. And solder joints with Cu contents are seems to similar in strength regardless of reflow time. on the other hand, in the case of Ni plate joints, shear strength of Sn-37Pb solder joints are similar to Sn-4Ag solder joints. Like Cu plate joints, solder joints with Cu contents are seems to similar in strength regardless of reflow time.