HEPS-BPIX3: a fine pitch pixel readout chip working in single photon counting mode for synchrotron radiation applications

HEPS-BPIX3 is a hybrid pixel detector readout chip for X-ray applications for the High Energy Photon Source (HEPS) in China. The readout chip contains an array of 88 × 88 pixels with a pixel size of 55 μm × 55 μm, working in single photon counting mode. Each pixel handles both polarities of positive and negative input charge signals and has a counting depth of 11 bits. Using a clock with a frequency up to 160 MHz, the chip can read out serially with zero dead time. Designed in a 130 nm CMOS technology, the chip has been measured and given the CSA charge gain of 17.6 mV/ke- for electron collection and 13 mV/ke- for hole collection, respectively. Bump-bonded detector modules with a 320-μm-thick silicon sensor were also tested. The test results showed an equivalent input noise of 156 e- and a counting rate up to 2.2 Mcps. Besides, an image using an X-ray tube was demonstrated and a frame rate of 1.8 kHz could be guaranteed. Measured characteristics present the normal functionality of the HEPS-BPIX3 chip and prove that the chip satisfies the HEPS requirements.