材料科学
随时间变化的栅氧化层击穿
介电强度
光电子学
序列(生物学)
解耦(概率)
氧化物
电介质
晶体管
纳米片
可靠性(半导体)
双层
纳米技术
栅氧化层
电气工程
化学
物理
电压
工程类
膜
冶金
功率(物理)
控制工程
量子力学
生物化学
作者
Fernando Aguirre,Alok Ranjan,Nagarajan Raghavan,Andrea Padovani,Sebastián Pazos,Nahuel Vega,N. Müller,M. E. Debray,Joel Molina‐Reyes,K. L. Pey,Félix Palumbo
标识
DOI:10.35848/1882-0786/ac345d
摘要
Abstract The breakdown (BD) sequence in high-K/interfacial layer (HK/IL) stacks for time-dependent dielectric breakdown (TDDB) has remained controversial for sub-45 nm CMOS nodes, as many attempts to decode it were not based on proper experimental methods. Know-how of this sequence is critical to the future design for reliability of FinFETs and nanosheet transistors. We present here the use of radiation fluence as a tool to precisely tune the defect density in the dielectric layer, which jointly with the statistical study of the soft, progressive and hard BD, allow us to infer the BD sequence using a single HfO 2 –SiO x bilayered MOS structure.
科研通智能强力驱动
Strongly Powered by AbleSci AI