Hyper RDL (HRDL) Interposer by Layer Transfer Technology for 3D IC and Advanced Packaging

Interposer technology is essential for electrical connections between dies and components. Among silicon, glass, and re-distribution layer (RDL) interposers, RDL offers improved signal integrity and cost reduction. This study expands on Hyper RDL (HRDL) interposers, using layer transfer and low-temperature hybrid bonding interconnects (L THBI) to achieve multilayer stacking with reduced warpage and high flexibility in fine and coarse pitch RDL stacking design. Moreover, L THBI enhances interposer integrity while lowering the thermal budget. Compared to conventional RDL interposers, HRDL demonstrates superior performance and flexibility, paving the way for the next generation of advanced packaging solutions, offering a multi-layer, low-warpage, cost-effective, and adaptable alternative for heterogeneous integration in 3D IC.