微观结构
材料科学
透射电子显微镜
原位
超声波传感器
纳米颗粒
复合材料
累积滚焊
扫描电子显微镜
纳米技术
结晶学
声学
物理
气象学
化学
作者
Chihiro Iwamoto,Yoshimi Ohtani,Koichi Hamada
标识
DOI:10.1016/j.scriptamat.2023.115560
摘要
In-situ transmission electron microscopy (TEM) is developed to observe the microstructure evolution during ultrasonic bonding. It was found that many nanoparticles were generated and moved around between the Al sheets’ contact regions in a random way. Gaps between the joining partners were buried by the nanoparticles, which facilitated the formation of the bonded interface. It was shown that the in-situ TEM observation technique provides a new way to investigate the ultrasonic bonding process.
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