Experimental Study on Heat Transfer Performance of Micro-Channel Heat Pipe

To solve the thermal management problem of high-power electronic components, this paper designs a new type of capsule shaped microchannel heat pipe and combines the designed heat pipe with a needle rib heat sink to form a heat dissipation module. The heat dissipation performance, thermal response state, and thermal resistance of the module under air cooling were experimentally studied, and the temperature uniformity of the heat pipe under local heat sources was explored. The results indicate that a wind speed of 2.4 m/s is the economic wind speed for the module, and simply increasing the wind speed and radiator area cannot continuously enhance the cooling performance of the heat pipe; The increase in heat source power will intensify the phase transition of the working fluid, and the minimum one-dimensional thermal resistance value of the heat pipe is 0.1411 °C/W. When the local heat source power is high, the temperature of the heat pipe group is reduced by 11 °C compared to the control group. Heat pipe can better exhibit temperature equalization characteristics under high heat source power, and the central local heat source is more conducive to the boiling of the working fluid than the edge local heat source.