材料科学
陶瓷
热导率
小型化
钻石
氮化硼
碳化硅
电介质
氮化物
碳化物
碳化硼
氮化硅
电子设备和系统的热管理
复合材料
工程物理
纳米技术
硅
冶金
光电子学
机械工程
工程类
图层(电子)
标识
DOI:10.1002/adma.19920040112
摘要
Inorganic Materials V : Insulating dielectric materials which prossess a high thermal conductivity are required for the dissipation of heat from electrical and electronic equipment. As dissippation requirements increase with the miniaturization of circuitry, materials such as diamond, boron nitride, and silicon carbide are being used to replace alumina. The various materials and their applications are discussed.
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