聚酰亚胺
材料科学
反应离子刻蚀
等离子体刻蚀
蚀刻(微加工)
制作
干法蚀刻
复合材料
等离子体
各向同性腐蚀
图层(电子)
医学
替代医学
物理
病理
量子力学
作者
B. Mimoun,H.T.M. Pham,Vincent Henneken,Ronald Dekker
出处
期刊:Journal of vacuum science and technology
[American Vacuum Society]
日期:2013-01-23
卷期号:31 (2)
被引量:21
摘要
The authors have found that patterning polyimide coatings containing organosilane adhesion promoter using pure oxygen plasma resulted in a thin silicon-rich residue layer. They show in this paper that adding small amounts of fluorine-containing gas to the etching gas mixture is necessary in order to achieve residue-free polyimide plasma etching. They report residue-free plasma etching of polyimide coatings with both isotropic and anisotropic profiles, using either metal or oxide hard masks. These etching methods are however not sufficient for the fabrication of high density metal filled vias in 10 μm thick polyimide coatings. In order to improve the metal step coverage over the vias while keeping the pitch as small as possible, the authors have developed a two-step etching recipe combining both isotropic and anisotropic profiles, resulting in wine-glass shaped vias.
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