断层(地质)
陷入故障
集成电路
过程(计算)
计算机科学
排名(信息检索)
可靠性工程
断层模型
故障覆盖率
样品(材料)
电子线路
物理设计
电子工程
故障检测与隔离
工程类
电气工程
人工智能
地震学
执行机构
化学
地质学
操作系统
色谱法
作者
John Paul Shen,Wojciech P. Maly,F. Ferguson
出处
期刊:IEEE Design & Test of Computers
[Institute of Electrical and Electronics Engineers]
日期:1985-01-01
卷期号:2 (6): 13-26
被引量:507
标识
DOI:10.1109/mdt.1985.294793
摘要
Inductive Fault Analysis (IFA) is a systematic Procedure to predict all the faults that are likely to occur in MOS integrated circuit or subcircuit The three major steps of the IFA procedure are: (1) generation of Physical defects using statistical data from the fabrication process; (2) extraction of circuit-level faults caused by these defects; and (3) classification of faults types and ranking of faults based on their likelihood of occurrence Hence, given the layout of an IC, a fault model and a ranked fault list can be automatically generated which take into account the technology, layout, and process characteristics. The IFA procedure is illustrated by its applications to an example circuit. The results from this sample led to some very interesting observations regarding nonclassical faults.
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