材料科学
各向异性
复合材料
变形(气象学)
无定形固体
氮化镓
微晶
凝聚态物理
结晶学
冶金
光学
物理
化学
图层(电子)
作者
Chen Li,Yinchuan Piao,Binbin Meng,Yong Zhang,Longqiu Li,Feihu Zhang
标识
DOI:10.1016/j.apsusc.2021.152028
摘要
• Crack-free plastic deformation mechanism of GaN induced by nanoscratch was revealed. • Material removal and deformation mechanisms have distinct anisotropy dependence induced by nanoscratch of GaN. • Scratch along [11–20] zone axis has deeper brittle-to-ductile transition depth and less phase transformation. • [11–20] direction is more conducive to achieve plastic removal and deformation. • Higher stress induces more phase transition, resulting in the decrease of volume and elastic recovery rate. Gallium nitride single crystal (GaN) is difficult to achieve high-efficiency and low-damage machining due to anisotropy, high hardness and brittleness. Nanoscratch tests of GaN single crystals was conducted on (0001) plane along different zone axes, and the anisotropy dependence of material removal and deformation behaviors were investigated systematically. The results showed that crack-free plastic deformation of GaN crystals could be acquired along different zone axes, which was dominated by phase transition, polycrystalline nanocrystals, amorphous transition, as well as close-to-atomic scale damages including stacking faults, dislocations and lattice distortions. As the stress increases, special surface radial cracks with the same orientations caused by shear stress will appear on the groove surface, and striated and step-shaped brittle fractures can be induced by the propagation and intersection of the cracks. The processing along [11–20] zone axis was more conducive to achieve the plastic removal and deformation, deeper penetration depth and less phase transformation. The higher stress along [1–100] zone axis induced more phase transition from hexagonal system to cubic system. This work will enhance the understanding of the anisotropy dependence of material removal and damage mechanisms, and provide a guide for achieving high-efficiency and low-damage machining of GaN crystals.
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