Thermal Properties and Fracture Behavior of Compositionally Graded Al-SiC<sub>p</sub> Composites
作者
Kyung Mok Cho,Il Dong Choi,Ik Min Park
出处
期刊:Materials Science Forum [Trans Tech Publications] 日期:2004-03-15卷期号:449-452: 621-624被引量:11
标识
DOI:10.4028/www.scientific.net/msf.449-452.621
摘要
Compositionally graded Al-SiC p composites were fabricated using pressureless infiltration process. Microstructure was examined and thermal properties were characterized for Al-SiC p composites. Al-SiC p composites with fairly uniform distribution and compositional gradient of SiC reinforcement in the Al matrix though the thickness direction was successfully fabricated. The thermal conductivity of Al-SiC p composites was measured at room temperature, 200°C and 400°C using laser flash method. Thermal conductivity of Al-SiC p composites increases non-linearly with decreasing the volume fraction of SiC. Cyclic thermal shock fatigue tests were performed by immersing Al-SiCp functionally graded materials(FGM) into water from the various heating temperatures of 400°C , 300°C and 200°C , repeatedly. After cyclic thermal shock fatigue tests, micro-hardness was measured and formation of cracks was investigated.e fati