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Chip to Wafer Hybrid Bonding Development for High Volume Manufacturing
1个月前
已完结
Influence of TaN films deposited using different N2 flow rates on the properties of Ta and Cu films in advanced 3D NAND memory
5个月前
已完结
Comparison of size-dependent characteristics of blue and green InGaN microLEDs down to 1 μ m in diameter
5个月前
已完结
The contact resistance reduction of Cu interconnects by optimizing the crystal behavior of Ta/TaN diffusion barrier
5个月前
已完结
Comparative study of Ta, TaN and Ta/TaN bi-layer barriers for Cu-ultra low-k porous polymer integration
5个月前
已关闭
Selective Copper Deposition on Barrier Layer Ta and TaN in the Presence of a Copper Seed Layer
5个月前
已完结
Influence of Composition of SiCN Film for Surface Activated Bonding
5个月前
已完结
Optimization of PVD SiCN Deposition for Cu/SiCN Hybrid Bonding Applications
5个月前
已关闭
Effects of annealing temperature on properties of InSnZnO thin film transistors prepared by Co-sputtering
8个月前
已完结
Role of ITO electrode in the resistive switching behavior of TiN/HfO2/ITO memory devices at different annealing temperatures
8个月前
已完结
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