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90 积分 2025-09-05 加入
Influence of TaN films deposited using different N2 flow rates on the properties of Ta and Cu films in advanced 3D NAND memory
2个月前
已完结
Comparison of size-dependent characteristics of blue and green InGaN microLEDs down to 1 μ m in diameter
2个月前
已完结
The contact resistance reduction of Cu interconnects by optimizing the crystal behavior of Ta/TaN diffusion barrier
2个月前
已完结
Comparative study of Ta, TaN and Ta/TaN bi-layer barriers for Cu-ultra low-k porous polymer integration
2个月前
已关闭
Selective Copper Deposition on Barrier Layer Ta and TaN in the Presence of a Copper Seed Layer
2个月前
已完结
Influence of Composition of SiCN Film for Surface Activated Bonding
2个月前
已完结
Optimization of PVD SiCN Deposition for Cu/SiCN Hybrid Bonding Applications
2个月前
已关闭
Effects of annealing temperature on properties of InSnZnO thin film transistors prepared by Co-sputtering
4个月前
已完结
Role of ITO electrode in the resistive switching behavior of TiN/HfO2/ITO memory devices at different annealing temperatures
4个月前
已完结
Integration of plasma dicing in the collective die to wafer hybrid bonding process
4个月前
已完结
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