Lv11
50 积分 2025-09-05 加入
Selective Copper Deposition on Barrier Layer Ta and TaN in the Presence of a Copper Seed Layer
1小时前
已完结
Influence of Composition of SiCN Film for Surface Activated Bonding
3小时前
已完结
Optimization of PVD SiCN Deposition for Cu/SiCN Hybrid Bonding Applications
4小时前
已关闭
Effects of annealing temperature on properties of InSnZnO thin film transistors prepared by Co-sputtering
2个月前
已完结
Role of ITO electrode in the resistive switching behavior of TiN/HfO2/ITO memory devices at different annealing temperatures
2个月前
已完结
Integration of plasma dicing in the collective die to wafer hybrid bonding process
2个月前
已完结
Short range optical communication with GaN‐on‐Si microLED and microPD matrices
2个月前
已完结
2000 PPI silicon-based AlGaInP red micro-LED arrays fabricated via wafer bonding and epilayer lift-off
3个月前
已完结
Monolithic full-color active-matrix micro-LED micro-display using InGaN/AlGaInP heterogeneous integration
3个月前
已完结
Recent progresses on InGaN red micro-LEDs for display
3个月前
已完结
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