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390 积分 2023-10-27 加入
Plasma-induced defect generation on silicon surfaces in HDP-CVD processing
2个月前
已完结
Three-Dimensional nand Flash Architecture Design Based on Single-Crystalline STacked ARray
2个月前
已完结
Overview of 3D NAND Technologies and Outlook Invited Paper
2个月前
已完结
Recent Progress on 3D NAND Flash Technologies
3个月前
已完结
Surface modification of poly(vinylidene fluoride) film by remote Ar, H2, and O2 plasmas
3个月前
已完结
Low-temperature preparation of SiO2/Si(100) interfaces using a two-step remote plasma-assisted oxidation-deposition process
3个月前
已完结
Low-temperature preparation of SiO2/Si(100) interfaces using a two-step remote plasma-assisted oxidation-deposition process
3个月前
已完结
Selective Barrier for Cu Interconnect Extension in 3nm Node and Beyond
3个月前
已完结
Novel Low Thermal Budget Bonding Using Single Wafer Thermal Processing System, Resulting in Excellent Wafer-to-Wafer Hybrid Bonding at sub-0.5um Pitch
3个月前
已完结
Influence of annealing conditions on the mechanical and microstructural behavior of electroplated Cu-TSV
3个月前
已完结
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