Lv11
50 积分 2023-10-27 加入
The formation of ultrathin silicon oxide films using H2/N2O mixtures
1小时前
已完结
Mitigating Process-Induced Wafer Distortion for Enhanced Overlay and Thickness Uniformity
1小时前
已完结
Comparative evaluation of gap-fill dielectrics in shallow trench isolation for sub-0.25 μm technologies
1个月前
已完结
Subatmospheric chemical vapor deposition ozone/TEOS process for SiO2 trench filling
1个月前
已完结
Retrospective on ‘The 2012 Plasma Roadmap’
2个月前
已完结
Novel Materials as Interlayer Low-K Dielectrics for CMOS Interconnect Applications
2个月前
已完结
Improved electrical performance for 65nm node and beyond through the integration of HARP O<inf>3</inf>/TEOS oxide films for STI, PMD, and thin film applications
2个月前
已完结
Subatmospheric chemical vapor deposition ozone/TEOS process for SiO2 trench filling
2个月前
已完结
Temperature measurement in RTP: Past and future
3个月前
已完结
Wafer Temperature Measurement in RTP
3个月前
已完结
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