Lv12
20 积分 2023-10-27 加入
Comparative evaluation of gap-fill dielectrics in shallow trench isolation for sub-0.25 μm technologies
21小时前
已完结
Subatmospheric chemical vapor deposition ozone/TEOS process for SiO2 trench filling
21小时前
已完结
Retrospective on ‘The 2012 Plasma Roadmap’
4天前
已完结
Novel Materials as Interlayer Low-K Dielectrics for CMOS Interconnect Applications
4天前
已完结
Improved electrical performance for 65nm node and beyond through the integration of HARP O<inf>3</inf>/TEOS oxide films for STI, PMD, and thin film applications
7天前
已完结
Subatmospheric chemical vapor deposition ozone/TEOS process for SiO2 trench filling
19天前
已完结
Temperature measurement in RTP: Past and future
1个月前
已完结
Wafer Temperature Measurement in RTP
1个月前
已完结
Wafer Temperature Measurement in RTP
1个月前
已完结
The effect of backside films on rapid thermal oxidation (RTO) growth on silicon wafers
1个月前
已完结
皖公网安备34019202002308
