| 标题 |
Comparison between die attach film (DAF) and film over wire (FOW) on stack-die CSP application |
| 网址 | |
| DOI |
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| 其它 |
期刊:European Microelectronics and Packaging Conference 作者:C. Chung; C.W. Ku; H. Hsu; S. Fu 出版日期:2009-06-15 |
| 求助人 | |
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(2025-6-4)