| 标题 |
First Demonstration of Three-Dimensional Thermal Conductivity Distribution Measurements of Interconnect Stacks Down to 3nm Process Nodes |
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| DOI | |
| 其它 |
期刊:2025 IEEE International Electron Devices Meeting (IEDM) 作者:Zifeng Huang; Kaiqi Yang; Yiyun He; Zuoyuan Dong; Zixuan Sun; et al 出版日期:2025-12-06 |
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(2025-6-4)