| 标题 |
Simulation-Driven Insights Into Nanoindentationbased Adhesion Strength Measurement of Wafer-to-Wafer Bonds |
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| 其它 |
期刊:2025 26th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) 作者:Yusuf Burak Ozdemir; Oguzhan Orkut Okudur; Kris Vanstreels; Mario Gonzalez; Clement Merckling 出版日期:2025-05-24 |
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(2025-6-4)