| 标题 |
A quantification method for micro-defect size in copper foil based on motion-induced eddy current signal characteristics |
| 网址 | |
| DOI | |
| 其它 |
期刊:Measurement Science and Technology 作者:Bingkun Wei; Shuzhi Wen; Lisha Peng; Jinghua Zhang; Zheng Han; et al 出版日期:2025-01-08 |
| 求助人 | |
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(2025-6-4)