| 标题 |
Analysis of the high-efficiency and low-damage abrasive processing mechanism for SiC based on the SPH simulation of single-grain indentation and scratching |
| 网址 | |
| DOI | |
| 其它 |
期刊:AIP Advances 作者:Dong, Shi; Qingming Hou; Tengfei Ma; Tianchen Zhao; Jinping Pan 出版日期:2022-05-01 |
| 求助人 | |
| 下载 |
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(2025-6-4)