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Backside illuminated SPAD image sensor with 7.83μm pitch in 3D-stacked CMOS technology |
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期刊:2016 IEEE International Electron Devices Meeting (IEDM) 作者:T. Al Abbas; N. A. W. Dutton; O. Almer; S. Pellegrini; Y. Henrion; et al 出版日期:2016-12-01 |
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(2025-6-4)