| 标题 |
Warpage Behavior and Life Prediction of a Chip-on-Flex Package Under a Thermal Cycling Condition |
| 网址 | |
| DOI | |
| 其它 |
期刊:IEEE Transactions on Components, Packaging and Manufacturing Technology 作者:Jae-Won Jang; Kyoung-Lim Suk; Jin-Hyoung Park; Kyung-Wook Paik; Soon-Bok Lee 出版日期:2014-07-01 |
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(2025-6-4)