| 标题 |
Rigid-flexible active ester resin of hybridizing organosilicone-biphenyl-naphthalene with robust strength, low-dielectric, and low-hygroscopic epoxy thermosets toward electronics packaging |
| 网址 | |
| DOI | |
| 其它 |
期刊:Chemical Engineering Journal 作者:Junjie Cheng; Wenpeng Duan; Qiguang Liu; Chang Juan Jing; Zhenfeng Zhu; et al 出版日期:2026-02-18 |
| 求助人 | |
| 下载 |
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(2025-6-4)