Research on Hybrid UV-Curing G-POSS/Epoxy Resin /Unsaturated Polyester Insulation Nanocomposites

Polyhedral oligomeric silsesquioxanes epoxy resin (G-POSS) was prepared from 2,3-glycidyloxypropyl-trimethoxysilane (GTMS) by hydrolytic condensation. Thermal properties and electrical properties and UV-curing gel rate of G-POSS/epoxy resin (ER)/unsaturated polyester (UP) nanocomposites using diphenyliodide hexafluorophosphate (DPI·PF6) as initiator of curing reaction were investigated. The results showed that curing process of G-POSS/ER/UP is the double hybrid free radical/cationic polymerization. The gel rate of all the samples is more than 90%. G-POSS would decrease the electrical resistivity and increases the dielectric constant of the complex curing materials. Thermal stability is increased with the addition of G-POSS.