Electrodeposition of Nickel onto Polymers: A Short Review of Plating Processes and Structural Properties

This paper reviews the fundamental principles and techniques of nickel electrodeposition, with a particular focus on metallizing polymeric substrates. It outlines the electrochemical mechanisms involved in depositing nickel from an acidic Watts bath, detailing the roles of key electrolyte components—i.e., nickel sulfate, nickel chloride, and boric acid—and the influence of process parameters, such as current density, temperature, and pH, on deposit quality (density and surface condition) and mechanical properties. In addressing the unique challenges posed by non-conductive polymers, this review compares emerging methods like silver conductive paint, highlighting differences in deposition time, surface resistivity, and environmental impact. Additionally, this paper examines how process parameters affect the as-deposited microstructure, adhesion, and overall mechanical properties (such as hardness, ductility, and tensile strength), while identifying critical issues such as low deposition density and substrate degradation. These insights provide a structured background for optimizing electroplating processes for applications in electronics, automotive, aerospace, and biomedical sectors, and suggest future research directions to enhance deposition uniformity, sustainability, and process control.