Dynamic acid CuCl_2 etching uniformity and etching rate study

In this article,a dynamic etching of acid CuCl2 etching bath under the two systems of HCl/H2O2 and HCl/NH4Cl has been studied,the uniformity of etching and the etching rate has been respectively analyzed.The results show that the roughness of surface copper and the upper and the lower spray both influence on etching uniformity greatly,HCl/NH4Cl system has a higher etching rate relative to the HCl/H2O2 system and the relevant reference data has been provided for industrial production.