二硫化钼
薄脆饼
场效应晶体管
电子线路
单层
材料科学
晶体管
光电子学
柔性电子器件
制作
集成电路
化学气相沉积
数码产品
纳米技术
电气工程
工程类
电压
冶金
病理
医学
替代医学
作者
Na Li,Qinqin Wang,Cheng Shen,Wei Zheng,Hua Yu,Jing Zhao,Xiaobo Lu,Guole Wang,Congli He,Xie Li,Jianqi Zhu,Luojun Du,Rong Yang,Dongxia Shi,Guangyu Zhang
标识
DOI:10.1038/s41928-020-00475-8
摘要
Atomically thin molybdenum disulfide (MoS2) is a promising semiconductor material for integrated flexible electronics due to its excellent mechanical, optical and electronic properties. However, the fabrication of large-scale MoS2-based flexible integrated circuits with high device density and performance remains a challenge. Here, we report the fabrication of transparent MoS2-based transistors and logic circuits on flexible substrates using four-inch wafer-scale MoS2 monolayers. Our approach uses a modified chemical vapour deposition process to grow wafer-scale monolayers with large grain sizes and gold/titanium/gold electrodes to create a contact resistance as low as 2.9 kΩ μm−1. The field-effect transistors are fabricated with a high device density (1,518 transistors per cm2) and yield (97%), and exhibit high on/off ratios (1010), current densities (~35 μA μm−1), mobilities (~55 cm2 V−1 s−1) and flexibility. We also use the approach to create various flexible integrated logic circuits: inverters, NOR gates, NAND gates, AND gates, static random access memories and five-stage ring oscillators. Wafer-scale monolayers of MoS2 can be used to create flexible transistors and circuits that exhibit on/off ratios of 1010, current densities of ~35 μA μm−1 and mobilities of ~55 cm2 V−1 s−1.
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