Electronic Stuctures: Mechanically Guided Post‐Assembly of 3D Electronic Systems (Adv. Funct. Mater. 48/2018)

In article number 1803149, Yonggang Huang, Yihui Zhang, John A. Rogers, and co-workers present deterministic assembly processes for transforming conventional, planar devices based on flexible printed circuit board (FPCB) platforms into those with 3D architectures in a manner that is fully compatible with off-the-shelf packaged or unpackaged component parts. The strategy to 3D FPCB technologies creates immediate opportunities for designs in multifunctional systems that leverage state-of-the-art components.