材料科学
石墨烯
胶粘剂
复合材料
热重分析
热稳定性
纳米复合材料
氧化物
傅里叶变换红外光谱
铜
环氧树脂
扫描电子显微镜
银纳米粒子
抗剪强度(土壤)
导电体
纳米颗粒
化学工程
冶金
纳米技术
图层(电子)
工程类
土壤科学
土壤水分
环境科学
作者
Seyed Jamaleddin Peighambardoust,Hamed Rikhtegar,Parisa Mohammadzadeh Pakdel,Abdolreza Mirmohseni
摘要
In this research, a conductive adhesive based on epoxy resin as the polymer matrix and silver‐coated copper powder and silver‐coated reduced graphene oxide as conductive fillers was synthesized. Graphene oxide was synthesized by modified Hummer's method. It was reduced and modified by silver powder. Copper particles were coated with silver using the electroless plating method. Finally, conductive nanocomposite adhesives were prepared using conductive fillers with different weight fractions. The structural properties of fillers were identified by Fourier‐transform infrared (FTIR) and induced coupled plasma (ICP) analysis and the morphology of the samples by scanning electron microscopy (SEM). Finally, conductive properties, lap shear strength, and thermal stability of adhesive were evaluated. The conductive adhesive prepared with optimized properties have 70% weight percentage silver‐coated copper powder and 1% weight percentage silver‐coated reduced graphene oxide. The bulk resistivity of the optimum sample was 1.6 × 10 ‐2 Ω.cm, and the lap shear strength was 7.10 MPa. Also, thermogravimetric analysis showed that the weight loss of adhesive decreased from 88.72% to 30.55% during heating, which showed the addition of fillers improves the thermal stability of adhesive.
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