Multi‐copolymerization retouch butadiene styrene block polymer resin for dual temperature change curing of wood‐based interface

Abstract Carboxylated styrene‐butadiene latex (XSBL), attributed to its insufficient adhesion and poor water resistance, cannot be widely popularized in the adhesive industry. Herein, a novel XSBL‐based resin with high‐strength yet water‐resistant was reported, in which the butadiene macromolecular chains were grafted with acrylonitrile (AN) and acrylic acid‐2 hydroxyethyl ester (HEA) molecules, the crosslinking sites were esterified and expanded to construct a branched network structure, and the matrix was filled with nano‐SiO 2 particles treated by blending silane coupling agents. We show that the new resin, having a dual curing mechanism at low and high temperatures, can be glued under different conditions. At room temperature, the sample group with a doping level of 1.33 wt% could achieve an overload shear strength of 3.17 MPa after curing, which is 233.7% higher than the XSBL; in the high temperature curing regime, the glue strength reached 1.21 MPa, much higher than the standard for the use of GB Class I plywood (≥0.7 MPa). The physicochemical properties meet the requirements for potential industrialization, for which the property–structure relation has been extensively explored. Further DSC and TG tests provide evidence for their wide application in the hot pressing process of man‐made plywood.