Lignin Biobased Eco-Friendly Dipping System for Polyimide Fiber and Its Interface Adhesive Mechanism with Rubber

胶粘剂 聚酰亚胺 环境友好型 木质素 材料科学 纤维 天然橡胶 接口(物质) 机制(生物学) 复合材料 高分子化学 化学工程 化学 图层(电子) 有机化学 工程类 接触角 生态学 哲学 认识论 坐滴法 生物
作者
Huaqing Li,Nan Tang,Jianing Cui,Haodong Yan,Shipeng Wen,Yan Shi,Weidong Wu
出处
期刊:Industrial & Engineering Chemistry Research [American Chemical Society]
卷期号:63 (27): 11939-11949 被引量:5
标识
DOI:10.1021/acs.iecr.4c01129
摘要

Fiber-reinforced rubber materials find extensive applications in tire manufacturing, hoses, conveyor belts, and various industrial sectors. Polyimide (PI) fibers offer superior fatigue resistance, tensile strength, modulus, and high-temperature durability compared to aramid fibers, positioning them as ideal substitutes in the belt layers of aircraft tire. To enhance the interfacial adhesion between polyimide fibers and rubber while minimizing the use of toxic and environmentally harmful materials, a novel eco-friendly carbon-reducing dipping system was devised. This system employs blocked diisocyanate and epoxy resin to activate PI fibers, and then uses a dipping solution, primarily composed of a blend of styrene–butadiene–vinylpyridine (VP) latex, lignin, tannic acid (TA), and glyoxal, to dip the fibers. This approach connects PI fibers and the rubber matrix through chemical bonds, thereby effectively enhancing the interfacial adhesion between the fibers and the rubber. The H pull-out force of the PI fiber cords treated by this system reached 179.6 N, with an average 180° peeling force of 14.7 N, and dynamic fatigue resistance exceeding 67,000 cycles, comparable to those achieved with the resorcinol-formaldehyde-latex (RFL) dipping system. These results indicate the efficacy of the developed system as a potential replacement for the RFL system. This research presents a sustainable and environmentally friendly approach to enhancing the interfacial adhesion of fiber-reinforced rubber composites, thereby contributing to the advancement of innovative high-performance fibers and biobased dipping system.
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