单片微波集成电路
放大器
高电子迁移率晶体管
符号
功率(物理)
数学
电气工程
拓扑(电路)
晶体管
物理
组合数学
工程类
算术
量子力学
电压
CMOS芯片
作者
Hui Jin,Fei Yang,Hongqi Tao,Wei Xiao,Yanfang Zhou,Likang Cai
标识
DOI:10.1109/lmwt.2023.3328277
摘要
A Ku -band high-power monolithic microwave integrated circuit (MMIC) is presented using 0.2- $\mu $ m GaN high electron mobility transistor (HEMT) technology. The high output power is achieved by a novel back-to-back topology to synthesize two sub-power amplifiers (sub-PAs). The MMIC demonstrates an output power of 50.2–50.8 dBm with a power gain of more than 18 dB and a power added efficiency (PAE) of 35%–41% at a drain voltage of 28 V (100- $\mu $ S pulsewidth and 10% duty cycle) in the frequency range of 14–18 GHz. The chip size is 5.8 $\times$ 6.6 mm $^{2}$ . To the best of our knowledge, this output power is the highest reported to date for a 14–18-GHz GaN power amplifier MMIC at 28-V drain voltage.
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