Recent Technical Trends of SIS Based Hot Melt Pressure Sensitive Adhesive for Label Application

This paper reviews the recent technical trend of SIS based Hot Melt Pressure Sensitive Adhesive and the novel asymmetric SIS for label application developed by the authors and its improved HMPSA performances. In case of low temperature performance is prioritized for SIS based adhesives, there are issues with label processability （die-cutting），which is important from the perspective of productivity, and migration of the oil blended into the adhesive. This is because there are trade-offs between low temperature performance and these two factors, and it is not possible to satisfy all of them at the same time. By controlling the novel block structure of SIS, the authors can control its Morphology to Spherical, even for SIS with high styrene content, and succeeded in developing an SIS-based HMPSA that satisfies all the performance requirements of low-temperature performance, antioil migration and high-speed die-cuttability.