One-dimensional Cu–Ni core–shell composites as liquid epoxy molding compound fillers for enhanced heat dissipation and electromagnetic interference shielding in high-bandwidth memory

One-dimensional core–shell Cu–Ni composites (CS-CN) improve EMI shielding and heat dissipation of liquid epoxy molding compounds through high thermal conductivity, all-frequency EMI shielding, and uniform filler distribution at low mass loadings.