| 标题 |
Thermo-Mechanical Warpage Prediction and Validation of Large Chiplet Packages |
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期刊:2026 27th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) 作者:Klara Volckaert; Riet Labie; Kurt Herremans; Kris Vanstreels; Mario Gonzalez; et al 出版日期:2026-04-19 |
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(2025-6-4)