| 标题 |
Profile evolution and mechanisms in pulsed-bias plasma etching of high-aspect-ratio silicon pillars for wafer-scale metasurface manufacturing |
| 网址 | |
| DOI | |
| 其它 |
期刊:Journal of vacuum science & technology 作者:J. D. Guo; Zhengming Liu; Mingqiang Geng; Kunrun Song; Huiyun Jiang; et al 出版日期:2026-07-22 |
| 求助人 | |
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(2025-6-4)