主动冷却
材料科学
空气冷却
环境科学
声学
机械工程
工程类
物理
作者
Boyang Peng,Zhiran Yi,Yu Fan,Xiuxuan Li,Xingyu Wei,Chenxi Wang,Xuying Chen,Jinghui Xu,Wenming Zhang
出处
期刊:Chip
[Elsevier BV]
日期:2025-08-12
卷期号:5 (1): 100163-100163
被引量:3
标识
DOI:10.1016/j.chip.2025.100163
摘要
As the power consumption and miniaturization of electronic devices increase, traditional liquid cooling and fan systems struggle to meet the high heat flux requirements, especially in space-constrained devices. Piezoelectric effect can convert electrical energy into mechanical energy, which is commonly used for sensing and actuating, especially in microscale due to its high integration capacity. Recently, piezoelectric micro-fan attracts more attention due to its efficient heat dissipation with advantages in low energy consumption, high performance, and compact design. The review introduces the working principles of piezoelectric fans or jet-based coolers, summarizes their structural designs and their performances, and discusses the pros and cons in practical applications, particularly focusing on the impact of piezoelectric moving component’s designs, cavity designs, and airflow apertures on cooling performance. Additionally, the review explores the layout optimization and installation configurations of piezoelectric coolers, discussing the best usage scenarios. Overall, piezoelectric cooling technologies show great potential for future electronic device heat management, especially for high-performance, low-power miniaturized devices.
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