Reliability analysis and testing of chip scale package solder joint

Using ANSYS finite element analysis software,a simple two-dimensional model was built for chip scale package(CSP) components,and then the stress and strain distribution of CSP components under thermal cycling were simulated with this model.The dangerous point of CSP components structural failure was found through simulation,and the thermal fatigue life of solder joints at the dangerous point was then predicted.Finally,the reliability of CSP solder joints was tested.The results show that using thin chips can improve the reliability of solder joints.When chip thickness decreases from 0.625 mm to 0.500 mm and 0.350 mm,the reliability of solder joints increases by about 75% and 150%,respectively.