| 标题 |
Heterogeneous Integration on Organic Interposer Substrate with fine-pitch RDL and 40 micron pitch Micro-bumps |
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| 其它 |
期刊:2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) 作者:Katsuyuki Sakuma; Griselda Bonilla; Dale McHerron; Toyohiro Aoki; Russell Kastberg; et al 出版日期:2023-08-04 |
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(2025-6-4)