Review of enhancing thermal conductivity in polymer-based dielectrics as passive components

Polymer dielectrics play a pivotal role in modern electronic applications, including oscillators, resonant circuits, electronic filters, and energy storage systems. However, the relentless pursuit of higher power densities and operating frequencies in next-generation electronics has led to exponential growth in heat generation. Conventional polymer dielectrics, with their inherently low thermal conductivity (< 0.5 W·m −1 ·K −1 ), struggle to dissipate this accumulated heat efficiently, leading to elevated operating temperatures and increased risk of premature dielectric breakdown. To ensure long-term stability and reliability in high-performance electronic systems, a fundamental understanding of heat transfer mechanisms and dielectric behaviour in polymers is essential. Furthermore, novel material‐design approaches are needed to boost dielectric performance and thermal conductivity in tandem, allowing polymer dielectrics to fulfil the exacting demands of next-generation passive components.