| 标题 |
Multimodal thermal wave imaging and pseudo-3D morphological reconstruction for quantitative detection of micron-scale cracks in solder joints |
| 网址 | |
| DOI | |
| 其它 |
期刊:NDT & E International 作者:Rongcheng Li; Fei Wang; Feng Yang; Jiaye Chen; Hai Zhang; et al 出版日期:2026-10-01 |
| 求助人 | |
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(2025-6-4)