| 标题 |
 Feasibility Demonstration of Server Chip Package With Direct-to-Chip Optical Transceivers |
| 网址 | |
| DOI |
10.1115/ipack2022-97455
doi
|
| 其它 |
期刊：ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems 作者：Shidong Li; Bakul Parikh; Chelsea Savoy; Daniel Kuchta; Guillaume Jutras; et al 出版日期：2022-10-25 |
| 求助人 | |
| 下载 | 暂无链接，等待应助者上传 |
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(2025-6-4)
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